Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
Electronic devices used for extreme high temperature (>500oC) for instance in aviation and aerospace applications, continue to be in demand. Ag-Cu nanopaste, which is a mixture of Ag and Cu nanoparticles and organic additives (PVA binder, Ethylene glycol), has been introduced as die attachment...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2017
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| Online Access: | http://eprints.usm.my/45824/1/Optimization%20Of%20Silver%20Nanoparticles%20Sizes%20In%20Ag-Cu%20Nanopaste%20As%20Die-Attach%20Materials%20For%20High%20Temperature%20Applications.pdf |
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