Optimization Of Diebond And Wirebond To Improve Non Stick On Pad Issue
One of the largest losses in semiconductor assembly operations is non-stick on pad (NSOP) failures. NSOP failures are costly as the entire device will need to be rejected if there is one such failure on any bond pad. The review is aim to look at the failure modes associated with poor bond pad qualit...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English English |
| Published: |
2020
|
| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/25579/2/Optimization%20Of%20Diebond%20And%20Wirebond%20To%20Improve%20Non%20Stick%20On%20Pad%20Issue.pdf http://eprints.utem.edu.my/id/eprint/25579/3/Optimization%20Of%20Diebond%20And%20Wirebond%20To%20Improve%20Non%20Stick%20On%20Pad%20Issue.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|