Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
Microelectronic packages with ball grid array (BGA) solder interconnects are subjected to thermomechanical load cycles during fabrication and throughout service life. The lead-free solder joints of BGA respond to both temperature and strain-rate depends on the exposed temperature cycles. Consequentl...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2021
|
| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/102081/1/SitiFaizahMadPSKM2021.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|