Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
The growth of advanced electronics has brought human to new eras which allow human to fully utilize the innovation of technology in daily applications. As semiconductor industry develops rapidly, flip chip based electronic packaging faces new challenges for packaging design and performance to meet f...
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| 主要作者: | |
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| 格式: | Thesis |
| 語言: | English |
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2010
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| 主題: | |
| 在線閱讀: | http://eprints.utm.my/id/eprint/12290/4/BooNanShingMFKM2010.pdf |
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