Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
Solder joint reliability (SJR) is an important requirement in electronics packaging. Most of the failures in a package are found in solder joints and interconnections. Brittle solder/intermetallic (IMC) interface fracture is the dominant failure mode in cases of impact loading and fast mechanical fa...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2012
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| Online Access: | http://eprints.utm.my/id/eprint/37971/5/AliffFarhanMohdYaminMFKM2012.pdf |
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