Optimal heat transfer of heat sink design based on electronic package thermal distribution using COMSOL package software
Due to the advanced development in semiconductor technology, the size of electronic component and devices become smaller while the performance becomes significantly greater. The increased of power density in the system causes the system components to either operate at higher temperature which led to...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2015
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/53547/1/RashidahRosliMFKE2015.pdf |
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