APA引文

Lim, C. W. (1998). Process integration issues of self-aligned titanium silicide technology (Ti-Salicide) in deep sub-micron CMOS devices fabrication.

Chicago Style (17th ed.) Citation

Lim, Chong Wee. Process Integration Issues of Self-aligned Titanium Silicide Technology (Ti-Salicide) in Deep Sub-micron CMOS Devices Fabrication. 1998.

MLA引文

Lim, Chong Wee. Process Integration Issues of Self-aligned Titanium Silicide Technology (Ti-Salicide) in Deep Sub-micron CMOS Devices Fabrication. 1998.

警告：這些引文格式不一定是100％准確.