Process integration issues of self-aligned titanium silicide technology (Ti-Salicide) in deep sub-micron CMOS devices fabrication /

Process integration issues of self-aligned titanium silicide technology (Ti-Salicide) in deep sub-micron CMOS devices fabrication /

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Bibliographic Details
Main Author: Lim, Chong Wee
Format: Thesis Book
Language:English
Published: 1998.
Subjects:
Silicides.
Integrated circuits > Ultra large scale integration > Materials.
Metal oxide semiconductors, Complementary > Design
Titanium.
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