Delamination propagation in plastic IC packages during solder reflow /
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| 主要作者: | |
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| 格式: | Thesis 圖書 |
| 語言: | English |
| 出版: |
1999.
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| 主題: | |
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| Item Description: | Spine title: Delam. prop. in plastic IC packages during solder reflow. |
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| 實物描述: | xi, 130 leaves : ill. ; 30 cm. |
| 參考書目: | Bibliography: leaves 123-130. |