A new methodology for modeling vapour pressure development during solder reflow in IC packages /

A new methodology for modeling vapour pressure development during solder reflow in IC packages /

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书目详细资料
主要作者:	Koh Sau Wee
格式:	Thesis 图书
语言:	English
出版:	2002.
标签:	添加标签没有标签, 成为第一个标记此记录!

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