A new methodology for modeling vapour pressure development during solder reflow in IC packages /

A new methodology for modeling vapour pressure development during solder reflow in IC packages /

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書目詳細資料
主要作者:	Koh Sau Wee
格式:	Thesis 圖書
語言:	English
出版:	2002.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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