Study of improvement in wire bonding process through critical parameters analysis /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2011.
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| LEADER | 01282cam a2200289 a 4500 | ||
|---|---|---|---|
| 001 | u846838 | ||
| 003 | SIRSI | ||
| 005 | 201112161049 | ||
| 008 | 111216s2011 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ | ||
| 090 | |a TS176 |b UM 2011 Ong | ||
| 097 | |a TS176 |b UM 2011 Ong | ||
| 100 | 1 | |a Ong, Siew Kee. | |
| 245 | 1 | 0 | |a Study of improvement in wire bonding process through critical parameters analysis / |c Ong Siew Kee. |
| 260 | |c 2011. | ||
| 300 | |a [1] x, 70 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng. (Manuf.)) -- Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan, Universiti Malaya, 2011. | ||
| 504 | |a Bibliography: leaves 66-70. | ||
| 650 | 0 | |a Wire bonding (Electronic packaging). | |
| 650 | 0 | |a Electric circuit analysis. | |
| 650 | 0 | |a Electronic packaging |x Reliability. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Rekabentuk dan Pembuatan. | |
| 900 | |a NHS | ||
| 596 | |a 1 7 | ||
| 999 | |a TS176 UM 2011 ONG |w LC |c 1 |i A514878786 |d 29/6/2012 |f 29/6/2012 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 27/6/2012 | ||
| 999 | |a TS176 UM 2011 ONG |w LC |c 1 |i A514827387 |d 5/12/2012 |f 5/12/2012 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 4/12/2012 | ||
| 999 | |a TS176 UM 2011 ONG |w LC |c 2 |i A514906116 |d 10/9/2014 |f 10/9/2014 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 10/9/2014 | ||