Development of high-temperature lead-free solder for semiconductor chip attachment /
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| 主要作者: | |
|---|---|
| 格式: | Thesis 图书 |
| 语言: | English |
| 出版: |
2011.
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| LEADER | 01478cam a2200349 i 4500 | ||
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| 001 | u854555 | ||
| 003 | SIRSI | ||
| 005 | 201204101723 | ||
| 008 | 120410s2011 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ |d AUM |e rda | ||
| 090 | |a TJ7 |b UM 2011 Haq | ||
| 097 | |a TJ7 |b UM 2011 Haq | ||
| 100 | 1 | |a Haque, Ashraful. | |
| 245 | 1 | 0 | |a Development of high-temperature lead-free solder for semiconductor chip attachment / |c Ashraful Haque. |
| 264 | 1 | |c 2011. | |
| 264 | 4 | |c 2011. | |
| 300 | |a xviii, 101 leaves : |b illustrations ; |c 30 cm. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |a Dissertation (M.Eng.Sc.) -- Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya, 2011. | ||
| 504 | |a Bibliography: leaves 96-101. | ||
| 650 | 0 | |a Lead-free electronics manufacturing processes. | |
| 650 | 0 | |a Semiconductors |x Design and construction. | |
| 650 | 0 | |a Microelectronic packaging. | |
| 650 | 0 | |a Solder and soldering. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik. | |
| 900 | |a NHS-ZA | ||
| 596 | |a 1 7 25 | ||
| 999 | |a TJ7 UM 2011 HAQ |w LC |c 1 |i A515046458 |d 30/4/2015 |e 30/4/2015 |f 31/10/2012 |g 1 |l STACKS |m P01UTAMA |n 1 |r Y |s Y |t TESIS |u 31/10/2012 | ||
| 999 | |a TJ7 UM 2011 HAQ |w LC |c 1 |i A515013344 |d 29/1/2013 |f 29/1/2013 |g 1 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 29/1/2013 | ||
| 999 | |a TJ7 UM 2011 HAQ |w LC |c 1 |i A515013358 |d 29/1/2013 |f 29/1/2013 |g 1 |l STACKS |m P25UMARCHI |r N |s Y |t CD |u 29/1/2013 |o .STAFF. MST-CD638 | ||