Effects of molybdenum nanoparticles on lead-free tin-based solder /
Saved in:
主要作者: | Mahmood, Md. Arafat (Author) |
---|---|
格式: | Thesis 圖書 |
語言: | English |
主題: | |
在線閱讀: | http://studentsrepo.um.edu.my/id/eprint/8373 |
標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
相似書籍
-
Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate /
由: Mahdavifard, Mohammad Hossein
出版: (2013) -
The electrical properties of element-added (FE, AL) lead-free solder alloys : experimental and materials modeling approaches /
由: Nur'aishah Aminah Mohd Amin
出版: (2015) -
Electrodeposition and characterization of SN-BI lead-free soldier alloys /
由: Goh, Ying Xin
出版: (2015) -
Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
由: Chew, Chee Sean
出版: (2011) -
Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
由: Muhammad Hafiz, Zan @ Hazizi