Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications /

Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications /

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书目详细资料
主要作者:	Shnawah, Dhafer Abdul-Ameer
格式:	Thesis 图书
语言:	English
出版:	2013
主题:	Alloys > Microstructure. Alloys > Thermal properties. Microstructure.
标签:	添加标签没有标签, 成为第一个标记此记录!

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