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Electronic packaging
Reliability
Wire bonding (Electronic packaging)
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Electric circuit analysis
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Study of the effect of process variation on wire bond process of IC assembly /
by
Intan Mastura Saadon
Published 2012
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First bonding parameter optimization in wire bonding process /
by
Syila Izawana Ismail
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Study of improvement in wire bonding process through critical parameters analysis /
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Ong, Siew Kee
Published 2011
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Optimization and reliability of wirebond looping profile for broken neck failure /
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Teoh, Cheng Lock
Published 2012
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Institution
Universiti Malaya
4
Collection
Catalog
4
Author
Intan Mastura Saadon
1
Ong, Siew Kee
1
Syila Izawana Ismail
1
Teoh, Cheng Lock
1
Granting Institution
Universiti Malaya.
4
Language
English
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Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group
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