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  1. 1
    Process integration issues of self-aligned titanium silicide technology (Ti-Salicide) in deep sub-micron CMOS devices fabrication /
    由 Lim, Chong Wee
    出版 1998
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  2. 2
    A study of stress in backend metallization in ULSI devices /
    由 Goh, Chia Lan
    出版 2006
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  3. 3
    Probing technique for energy distribution of positive charges in gate dielectrics and its application to lifetime prediction /
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