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Showing 1 - 20 results of 29 for search '"Electronic packaging."', query time: 0.05s Refine Results
  1. 1
    First bonding parameter optimization in wire bonding process /
    Subjects: “...Wire bonding (Electronic packaging)...”
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  2. 2
    Study of the effect of process variation on wire bond process of IC assembly /
    by Intan Mastura Saadon
    Published 2012
    Subjects: “...Wire bonding (Electronic packaging)....”
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  3. 3
    Optimization and reliability of wirebond looping profile for broken neck failure /
    by Teoh, Cheng Lock
    Published 2012
    Subjects: “...Wire bonding (Electronic packaging) Production control....”
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  4. 4
    Study of improvement in wire bonding process through critical parameters analysis /
    by Ong, Siew Kee
    Published 2011
    Subjects: “...Wire bonding (Electronic packaging)....”
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  5. 5
    Camera Independent Face Recognition Algorithm In Visual Surveillance
    by Yew, Chuu Tian
    Published 2015
    Subjects: “...TK7870 Electronic packaging ...”
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  6. 6
    Highly Efficient Multi-Gigabit Commandstatus Packet Tunneling Technique In Inter-Fpga Packet Streaming Architecture
    by Loh, Mui Soon
    Published 2016
    Subjects: “...TK7870 Electronic packaging ...”
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  7. 7
    Investigation of the quality and reliability of copper interconnects /
    by Koh, Leong Tee
    Published 2000
    Subjects: “...Electronic packaging....”
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  8. 8
    Real-Time Capable Multi-Hop Media Access Control Protocol For Smart Home Environment
    by M.Shukeri, Nurulfaizal
    Published 2017
    Subjects: “...TK7870 Electronic packaging ...”
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  9. 9
    Validation of Colpitts Vco Design for Two Way Portable Radio Applications
    by Raj Arul, Aldrin
    Published 2013
    Subjects: “...TK7870 Electronic packaging ...”
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  10. 10
    Improving the Efficiency of Histogram of Oriented Gradient Feature for Human Detection
    by Lai, Chi Qin
    Published 2016
    Subjects: “...TK7870 Electronic packaging ...”
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  11. 11
    Improvement of Underwater Image Contrast Enhancement Technique Based on Histogram Modification
    by Abdul Ghani, Ahmad Shahrizan
    Published 2015
    Subjects: “...TK7870 Electronic packaging ...”
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  12. 12
    Crash Recovery Support For Variable Strength T-Way Test Generation Strategy
    by Abdullah, Syahrul Afzal Che
    Published 2016
    Subjects: “...TK7870 Electronic packaging ...”
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  13. 13
    Delamination propagation in plastic IC packages during solder reflow /
    by Ma, Yiyi
    Published 1999
    Subjects: “...Electronic packaging....”
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  14. 14
    The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
    by Ghazali Omar
    Published 2005
    Subjects: “...Wire bonding (Electronic packaging)...”
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  15. 15
    Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
    by Mohamad Firdaus Rosle
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)...”
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  16. 16
    An Expert System for Trouble Shooting - Auto Wire Bonder Machine
    by Ng, Yu Ting
    Published 1997
    Subjects: “...Wire bonding (Electronic packaging) - Case studies...”
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  17. 17
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
    Subjects: “...Electronic packaging Materials....”
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  18. 18
    Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /
    by Mohd Firdaus Manap
    Published 2017
    Subjects: “...Wire bonding (Electronic packaging)...”
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  19. 19
    The effects of annealing, temperature and humidity on tin whiskers formation /
    by Lee, Hua Xing
    Published 2009
    Subjects: “...Electronic packaging....”
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  20. 20
    A study of wire sweep during transfer molding on plastic IC packaging /
    by Wu, Jianhua
    Published 1996
    Subjects: “...Electronic packaging Materials...”
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