Process integration issues of self-aligned titanium silicide technology (Ti-Salicide) in deep sub-micron CMOS devices fabrication /

Process integration issues of self-aligned titanium silicide technology (Ti-Salicide) in deep sub-micron CMOS devices fabrication /

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书目详细资料
主要作者:	Lim, Chong Wee
格式:	Thesis 图书
语言:	English
出版:	1998.
主题:	Silicides. Integrated circuits > Ultra large scale integration > Materials. Metal oxide semiconductors, Complementary > Design Titanium.
标签:	添加标签没有标签, 成为第一个标记此记录!

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